AnnealREV 4.2 — SAC305 / LEAD-FREE
Thermal Profile Curve
Ramp Rate: 1.5–3.0 °C/s · N₂ Atmosphere · ±1°C Tolerance
SEM · 500× MAGNIFICATION
BGA Solder Joint Cross-Section
Cu₆Sn₅ IMC Layer · 2–4 µm Nominal · Post-Anneal
PROCESS ENGINEERING
The Ramp–Soak–Cool Sequence
Each degree is deliberate. Select a stage to see the engineering parameters alongside what's happening at the microstructural level inside the joint.
ENGINEERING PARAMETERS
Flux activators begin volatilizing. Thermal mass equalization across board layers prevents differential expansion stress.
Ramp too fast → thermal shock on ceramic capacitors
MICROSTRUCTURAL EVENT
Flux Activation & Solvent Evaporation
Organic acid flux activators begin attacking surface oxides on copper pads and solder powder. Solvent carriers evaporate, leaving active flux residue in contact with metal surfaces. No intermetallic formation yet.
CERTIFICATIONS & CAPABILITIES
Process Control IS the Product
Every parameter is documented. Every oven zone is calibrated. Every batch ships with a full thermal trace log — the paper trail that passes your audit.
Oven Calibration
Single-degree tolerance across all 9 zones of our Heller 1912 EXL convection oven.
9-zone profile — all within ±1°C
N₂ Atmosphere
Nitrogen-blanketed chambers prevent re-oxidation throughout the entire thermal cycle.
IPC Standard
IPC-A-610 Rev H Class 3 — highest reliability grade for continued performance in critical environments.
Thermal Cycle Validation
Our SAC305 profiles validated to 10,000 cycles per JEDEC JESD22-A104.
Defense & Aerospace
Method 1010 thermal shock compliance. Qualified for flight-critical hardware.
Supported Alloys
SAC305, SAC405, SnPb, SnAg, BiSn, InSn, and high-Ag high-reliability variants.
SERVED INDUSTRIES
FAILURE MODE ANALYSIS
What a Cold Joint Costs You
The difference between a properly annealed joint and a cold joint is invisible to the naked eye — until cycle 847 of your 85/85 test when the first micro-crack propagates to open circuit.
Incomplete wetting leaves unbonded solder powder at the pad interface. Micro-cracks initiate at the first thermal excursion and propagate through the bulk solder. Fails 85°C/85%RH testing before 1,000 hours.
Complete Cu₆Sn₅ IMC formation across 100% of the pad interface. Sub-3% void content by X-ray. Fine-grained microstructure after stress-relief anneal. Validated to 10,000 cycles per JEDEC JESD22-A104.
THERMAL PROFILE GUIDE
Get the Profiles That Prevent This
Reflow profiles for SAC305, SnPb, and lead-free high-reliability alloys — including recommended ramp rates, soak windows, and post-anneal parameters for IPC Class 3 applications.
Download the Thermal Profile GuideINTERACTIVE TOOL — NO SIGNUP REQUIRED
Profile Calculator
Enter your alloy system and board thickness to get a recommended ramp–soak–cool curve. Instant. No gating.
Select your alloy and board thickness,
then generate your profile.
Thermal Profile Guide for
Lead-Free High-Reliability
Solder Assemblies
Complete reflow profiles for SAC305, SAC405, SnPb, BiSn, and high-Ag alloys. Includes ramp rates, soak windows, TAL targets, and post-anneal parameters for IPC Class 3, aerospace, and EV applications.
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